네패스신소재 NEPES AMC

1. Define
    Protection the LED Chip from external Environment(Humidity, Shock etc.)
      ( Especially High Power : < 0.5Watt)
    Transparent the LED light
    Composition : Silicone Resin and some Additives (2part Silicone)
2. Encapsulation Process :
    Potting Process
    Silicone is potted to the LED
    → Cured (150℃ * 1~2Hrs)
3. Application : High Power LED ( LCD Back Light Unit LED, IlluminationLED)

4. Features
    Good Moldability (No Void, Good Adhesion, No Tacky etc.)
    Good Reliability ( High Transparency, Good Thermal Stability, PCT, T/C, MRT etc.)

(54587) 전북 익산시 석암로 99(팔봉동 841)
Tel) 063-833-2020 / Fax) 063-833-2199

(06719) 서울시 서초구 남부순환로 2415(서초동 1449-2) 하임빌딩 3층
Tel) 02-3470-2881~2 / Fax) 02-3470-2889

(28125) 충북 청원군 오창읍 과학산업3로 176(각리 644-4)
Tel) 043-240-0900 / Fax) 043-217-5400

Copyright 2017. NEPES AMC. All rights reserved.