네패스신소재 NEPES AMC

1. Define
    Protection the Chip from external Environment(Humidity, Shock etc.)
    Composition : Epoxy Resin, Hardner, Filler(Silica) , Some Additives
2. Encapsulation Process :
    EMC Tablet Inserted into the Transfer Mold Pot
    → Filling the Cavity and Cured(175℃ * 1~2min)
    → Ejected from the Cavity
    → Post Cured (175℃ * 4Hrs)

3. Application : All Types of Semiconductor Devices including Diode, Transister, IC, LSI, VLSI, Memory

4. Features
    Good Moldability (No Void, No Wire Sweep, Short Cure Time etc.)
    Good Reliability ( PCT, T/C, MRT , Solder Resistance etc.)
    Green EMC for Halogen Free

(54587) 전북 익산시 석암로 99(팔봉동 841)
Tel) 063-833-2020 / Fax) 063-833-2199

(06719) 서울시 서초구 남부순환로 2415(서초동 1449-2) 하임빌딩 3층
Tel) 02-3470-2881~2 / Fax) 02-3470-2889

(28125) 충북 청원군 오창읍 과학산업3로 176(각리 644-4)
Tel) 043-240-0900 / Fax) 043-217-5400

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