네패스신소재 NEPES AMC

1. Define
    Die Attach Adhesive for the BOC Package
    Composition : Epoxy Resin, Hardner, Rubber, Some Additives
2. Die Attach Process :
    Printing Process
       Adhesive is poured on the Substrate / Printed by Mat type Printer
       → B-Stage Cured(120℃ * 2Hrs)
       → Die Attached
       → Cured(175℃ * 2Hrs)
3. Application : BOC Package
    
PCB printed by PDAA                          BOC Package

4. Features
    Good Processability (No Void, Good Adhesion, No Wet-Out)
    Good Reliability (PCT, T/C, MRT etc.)

(54587) 전북 익산시 석암로 99(팔봉동 841)
Tel) 063-833-2020 / Fax) 063-833-2199

(06719) 서울시 서초구 남부순환로 2415(서초동 1449-2) 하임빌딩 3층
Tel) 02-3470-2881~2 / Fax) 02-3470-2889

(28125) 충북 청원군 오창읍 과학산업3로 176(각리 644-4)
Tel) 043-240-0900 / Fax) 043-217-5400

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