네패스신소재 NEPES AMC

1. Define
    Underfill the COF Package
    Composition : Epoxy Resin, Hardner, Some Additives
2. Underfill Process :
    Potting Process
    LEC potted on the Film
    → Filled into the gap of Chip and Film
    → Oven Cured (150℃ * 5~7min)

3. Application : Encapsulation the LCD Driver IC (COF Package)

4. Features
    Good Flowability (No Void, Good Filling, Short Cure Time etc.)
    Good Reliability (PCT, T/C, MRT etc.)
    No Impurity ( 1㎛ Filltering)

(54587) 전북 익산시 석암로 99(팔봉동 841)
Tel) 063-833-2020 / Fax) 063-833-2199

(06719) 서울시 서초구 남부순환로 2415(서초동 1449-2) 하임빌딩 3층
Tel) 02-3470-2881~2 / Fax) 02-3470-2889

(28125) 충북 청원군 오창읍 과학산업3로 176(각리 644-4)
Tel) 043-240-0900 / Fax) 043-217-5400

Copyright 2017. NEPES AMC. All rights reserved.