네패스신소재 NEPES AMC

Package BOC Flip chip TSOP FBGA Discrete
Application DRAM MUF Nand MCP Finger print
sensor
SD-Card SOT
/
TO220
Mold type Transfer Transfer
/
Compression
Transfer Transfer Transfer
/
Compression
Transfer
/
Compression
Transfer
Feature High
workability
Narrow
gap filling
Good
Flow
High
Reliability
High DK Less wire
damage
Low cost
Grade 780VGV 752V-GM 770V-GP 705V-RW 785V-GC 780V-B 300T-F
Product emc boc emc Flip chip emc TSOP emc FBGA01 emc FBGA02 emc FBGA03 emc Discrete

(54587) 전북 익산시 석암로 99(팔봉동 841)
Tel) 063-833-2020 / Fax) 063-833-2199

(06719) 서울시 서초구 남부순환로 2415(서초동 1449-2) 하임빌딩 3층
Tel) 02-3470-2881~2 / Fax) 02-3470-2889

(28125) 충북 청원군 오창읍 과학산업3로 176(각리 644-4)
Tel) 043-240-0900 / Fax) 043-217-5400

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